HybridPACK™ Drive
HybridPACK™ Drive with Si and SiC technology is Infineon’s market leading power module for traction inverters of electric vehicles
HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicles traction applications offering a scalable power range of 100kW to 250kW within the 750 V and 1200 V class. Its design allows customers to scale performance levels, with thermal stacks and different chipsets, according to their desired cost-performance trade-off while maintaining the same module footprint.
The HybridPACK™ Drive was first introduced in 2017, using Infineon’s silicon EDT2 technology, specifically optimized to deliver the best efficiency on a real-world driving cycle. EDT2 decreased the module's chip area by 25%, improved switching performance and made it more cost-effective than infineon's preceding automotive power module, HybridPACK™ 2. The HybridPACK™ Drive is Infineon’s market-leading power module with a track record of close to three million pieces shipped for more than 20 electric vehicle platforms.
In 2021 Infineon introduced the new CoolSiC™ version, based on Infineon’s silicon carbide trench MOSFET structure. Compared to planar structures, the Trench enables a higher cell density, resulting in the best-in-class figure of merit. Therefore, trench MOSFETs can be operated at lower gate-oxide field strengths, resulting in increased reliability.
Currently, Infineon is working on the second generation of HybridPACK™ Drive which will be available from mid of 2023. The HybridPACK™ Drive G2 will be available with different current ratings, voltage levels (750V and 1200V) and Infineon’s the next generation chip technologies EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET. The product will provides high ease-of-use and new features, such as an integration option for next-generation phase current sensor and on-chip temperature sensing, to enable system cost improvements.
- Most scalable power portfolio in the market with IGBTs and CoolSiC™ in 1200/750 V for various power classes, without need for major system redesign
- Best-in-class EDT2 and CoolSiC™ chipset with high power density and soft switching behavior for ease of design for traction inverters in EV
- Roadmap products will continue the success: EDT3 and CoolSiC™ G2 with new benchmark performance and efficiency, targeting improved cost/performance ratio
- Full automotive qualification AQG324
This complete system solution based on HybridPACK™ Drive accelerates design-in for traction inverters up to 300Kw. It demonstrates the market’s most scalable power solutions with HybridPACK™ Drive CoolSiC™ G2, EiceDRIVER™ isolated gate drivers, coreless current and rotor position sensors, and AURIX™ MCUs. The Evalkit will be available in mid of 2023.
- Get to know Infineon’s IPOSIM tool, specifically for an automotive electric vehicle inverter
- Discover the steps involved in simulating different parameters and comparing the results of different Infineon products to see which is the best fit for your application
- Understand Infineon’s purpose in delivering quality above and beyond the standard and find out how we execute that standard in development, qualification, manufacturing and testing
- Learn where and how this high-quality standard is reflected and discover our success stories
HybridPACK™ Drive addresses the 3 main challenges that main inverter solutions currently face:
- Performance increase
- Scalable performance
- And ease-of-design, aimed at reducing customer’s time to market and system cost.
- Infineon's HybridPACK™ Drive silicon carbide compact power modules cater to the increasing demand for high range, efficiency, and power in electrified vehicles, enabling longer drive range, compact size, and optimized system cost.
- The second generation of Infineon's HybridPACK™ Drive, utilizing CoolSiC™ technology, offers a scalable product family with enhanced features and package improvements, providing added value to customers.